BAKE SYSTEM HAVING COOLING APPARATUS USING HEAT PIPE TO HEAT AND COOL UNIFORMLY ENTIRE REGION OF BAKE PLATE

• Main Authors: LEE, JIN SEONG, KIM, SANG GAP, SHIN, DONG HWA, KIM, TAE GYU, LEE, DONG U
• Format: Patent
• Language: English; Korean
• Published: 21.09.2004
• Edition: 7
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

PURPOSE: A bake system having a cooling apparatus using a heat pipe is provided to heat and cool uniformly an entire region of a bake plate and reduce a cooling period by using a heat pipe. CONSTITUTION: A bake system includes a plate, a heater for heating the plate, and a cooling apparatus for cooling the plate. The cooling unit includes a cooler, a refrigerant tank, and a temperature maintenance part. The cooler is installed at an opposite side of the plate(150) in order to cool the plate. A heater(152) is installed between the cooler and the plate. The refrigerant tank(160) is used for supplying the refrigerant to the cooler in a cooling process and storing the refrigerant in a heating process. The temperature maintenance part maintains constantly the temperature of the refrigerant in the cooling process.