ULTRASONIC PROBE INCLUDING CONDUCTIVE MATERIAL FOR ELECTRICALLY CONNECTING PIEZOELECTRIC TRANSDUCER AND CONDUCTIVE SUBSTRATE, AND METHOD FOR MANUFACTURING THE SAME

• Main Authors: SUDO MASAAKI, HIKI SUSUMU, SATO SHINICHI, SATO TAIHEI
• Format: Patent
• Language: English; Korean
• Published: 31.08.2004
• Edition: 7
• Subjects: DEAF-AID SETS; DIAGNOSIS; ELECTRIC COMMUNICATION TECHNIQUE; ELECTRICITY; FOR PERFORMING MECHANICAL WORK IN GENERAL; GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL; HUMAN NECESSITIES; HYGIENE; IDENTIFICATION; INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIRCHEMICAL OR PHYSICAL PROPERTIES; LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKEACOUSTIC ELECTROMECHANICAL TRANSDUCERS; MEASURING; MEDICAL OR VETERINARY SCIENCE; METHODS OR APPARATUS FOR GENERATING OR TRANSMITTING MECHANICALVIBRATIONS OF INFRASONIC, SONIC, OR ULTRASONIC FREQUENCY; PERFORMING OPERATIONS; PHYSICS; PUBLIC ADDRESS SYSTEMS; SURGERY; TESTING; TRANSPORTING

PURPOSE: An ultrasonic probe and a method for manufacturing the same are provided to prevent breakdown of piezoelectric material and achieve improved adhesion strength between a piezoelectric transducer and a conductive substrate. CONSTITUTION: An ultrasonic probe comprises a piezoelectric transducer(1) for transmitting/receiving ultrasonic waves; and a conductive substrate(6) electrically connected to the piezoelectric transducer. The conductive substrate is opposed to a side surface of the piezoelectric transducer. A corner portion(10) formed by the piezoelectric transducer and the conductive substrate is provided with a conductive material for electrically connecting the piezoelectric transducer and the conductive substrate.