APPARATUS FOR INSPECTING ARRAY OF ELECTRONIC COMPONENTS TO INSPECT IC PACKAGES DURING PACKAGING PROCESS IN WHICH IC PACKAGES ARE NOT SINGULATED AND REMAIN AS PART OF SUBSTRATES INCLUDING IC PACKAGES

• Main Authors: CHEN XU QIONG, LEUNG WING HONG, JANSSON DAVID ANDERS
• Format: Patent
• Language: English; Korean
• Published: 19.08.2004
• Edition: 7
• Subjects: BASIC ELECTRIC ELEMENTS; CALCULATING; COMPUTING; COUNTING; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; IMAGE DATA PROCESSING OR GENERATION, IN GENERAL; INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIRCHEMICAL OR PHYSICAL PROPERTIES; MEASURING; MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES; PHYSICS; SEMICONDUCTOR DEVICES; TESTING

PURPOSE: An apparatus for inspecting an array of electronic components is provided to inspect IC(integrated circuit) packages during a packaging process in which the IC packages are not singulated and remain as a part of substrates including the IC packages by using an improved apparatus for inspect...