APPARATUS FOR INSPECTING ARRAY OF ELECTRONIC COMPONENTS TO INSPECT IC PACKAGES DURING PACKAGING PROCESS IN WHICH IC PACKAGES ARE NOT SINGULATED AND REMAIN AS PART OF SUBSTRATES INCLUDING IC PACKAGES

PURPOSE: An apparatus for inspecting an array of electronic components is provided to inspect IC(integrated circuit) packages during a packaging process in which the IC packages are not singulated and remain as a part of substrates including the IC packages by using an improved apparatus for inspect...

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Bibliographic Details
Main Authors CHEN XU QIONG, LEUNG WING HONG, JANSSON DAVID ANDERS
Format Patent
LanguageEnglish
Korean
Published 19.08.2004
Edition7
Subjects
BASIC ELECTRIC ELEMENTS
CALCULATING
COMPUTING
COUNTING
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIRCHEMICAL OR PHYSICAL PROPERTIES
MEASURING
MEASURING ELECTRIC VARIABLES
MEASURING MAGNETIC VARIABLES
PHYSICS
SEMICONDUCTOR DEVICES
TESTING
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Summary:PURPOSE: An apparatus for inspecting an array of electronic components is provided to inspect IC(integrated circuit) packages during a packaging process in which the IC packages are not singulated and remain as a part of substrates including the IC packages by using an improved apparatus for inspecting electronic components like the substrates. CONSTITUTION: In the apparatus for inspecting the array of the electronic components, a scanning device that captures the images of each surface of each electronic component is included to inspect the surface of each electronic component. The scanning device is a line scanning device.
Bibliography:Application Number: KR20040008674