SEMICONDUCTOR DEVICE HAVING ABRASION-PROOF PAD FOR PREVENTING ABRASION AND DAMAGE OF TERMINAL

PURPOSE: A semiconductor device is provided to prevent abrasion and damage of a terminal by making the terminal contact a first conductor and by reducing a wafer test processing time for cleaning and polishing. CONSTITUTION: A semiconductor device includes a pad(1) for contacting a terminal(11) upon...

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Bibliographic Details
Main Authors SUGIHARA KEIJI, KIMURA NAOKI
Format Patent
LanguageEnglish
Korean
Published 30.07.2004
Edition7
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:PURPOSE: A semiconductor device is provided to prevent abrasion and damage of a terminal by making the terminal contact a first conductor and by reducing a wafer test processing time for cleaning and polishing. CONSTITUTION: A semiconductor device includes a pad(1) for contacting a terminal(11) upon an inspection or a measurement of electric properties of a semiconductor element. A first conductor(1a) and a second conductor(1b) are arranged on a surface of the pad. The first conductor has a hardness that is greater than that of the second conductor and not lower than that of the terminal. The first conductor is arranged on the surface of the pad such that the terminal hits the first conductor at least one time while the terminal is in contact with the surface of the pad and slides over the surface of the pad.
Bibliography:Application Number: KR20030061753