METHOD OF MANUFACTURING RESISTOR-EMBEDDED PRINTED CIRCUIT BOARD

PURPOSE: A method for fabricating a resistor-embedded PCB is provided to minimize the deviation of resistor and reduce the contact resistance of carbon ink by coating a solder-resist on a copper pad in a printing process of ink as a resistor on a surface of the PCB. CONSTITUTION: A conductive pad(10...

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Bibliographic Details
Main Author KO, YEONG JU
Format Patent
LanguageEnglish
Korean
Published 03.05.2004
Edition7
Subjects
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
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Summary:PURPOSE: A method for fabricating a resistor-embedded PCB is provided to minimize the deviation of resistor and reduce the contact resistance of carbon ink by coating a solder-resist on a copper pad in a printing process of ink as a resistor on a surface of the PCB. CONSTITUTION: A conductive pad(10) as an electrode of a resistor is formed on a surface of a PCB. A Ni/Au plated layer is formed on an upper surface of the conductive pads by performing an electroless Ni/Au plating process. A solder-resist(30) as an undercoating material is thickly coated between the conductive pads in order not to create a gap between the solder-resist(30) and the conductive pads. A resistor is formed between the conductive pads by printing ink(40) including carbon on an upper surface of the solder-resist(30). 본 발명은 인쇄 회로 기판에 수동 소자를 내장하여 제조하는 방법에 관한 것으로, 특히 저항을 내장한 인쇄 회로 기판의 제조 방법에 관한 것이다. 본 발명은 인쇄 회로 기판에 저항체로써 카본 잉크를 인쇄 할 때에 솔더레지스트로 구리 패드를 일정량 덮도록 함으로써 저항의 편차를 최소화 할 수 있으며, 구리 패드 표면에 니켈/금 도금을 수행함으로써 카본 잉크의 계면 접촉 저항을 감소 시킬 수 있다.
Bibliography:Application Number: KR20020065115