Lead-free solder alloy

PURPOSE: A lead-free alloy for soldering is provided in which soldering is performed by an alloy that does not contain lead so as to prevent damage due to poisoning of lead. CONSTITUTION: The lead-free alloy for soldering comprises 0.1 to 3.0 wt.% of copper (Cu), 0.001 to 1.0 wt.% of nickel (Ni), 0....

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Bibliographic Details
Main Authors YOON, WON GYU, KIM, GWAN SU
Format Patent
LanguageEnglish
Korean
Published 29.04.2004
Edition7
Subjects
ALLOYS
CHEMISTRY
FERROUS OR NON-FERROUS ALLOYS
METALLURGY
TREATMENT OF ALLOYS OR NON-FERROUS METALS
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Summary:PURPOSE: A lead-free alloy for soldering is provided in which soldering is performed by an alloy that does not contain lead so as to prevent damage due to poisoning of lead. CONSTITUTION: The lead-free alloy for soldering comprises 0.1 to 3.0 wt.% of copper (Cu), 0.001 to 1.0 wt.% of nickel (Ni), 0.001 to 3.0 wt.% of phosphorus (P), and a balance of tin (Sn). 본 발명은 전기 및 전자제품 생산시 부품을 기판에 고정시키는 역할을 하는 납땜용 무연 합금에 관한 것으로, 납을 사용하지 않고도 기존의 땜납보다 훨씬 향상된 융점, 산화량, 납땜강도를 얻을 수 있으며, 합금 중에 납이 포함되지 않음에 따라 납땜시 발생되는 가스 등에 의해 인체에 미치는 영향을 최소화 할 수 있다. 따라서 본 발명은 구리(Cu)가 0.1 ~ 3.0 중량% 이고, 니켈(Ni)이 0.001 ~ 1.0 중량% 이고, 인(P)이 0.001 ~ 3.0중량% 이며 나머지가 주석(Sn)으로 조성된 것이다.
Bibliography:Application Number: KR20020064613