METHOD, DEVICE AND PROGRAM FOR WIRE BONDING

PURPOSE: To prevent a wire loop from contacting the object in wire bonding. CONSTITUTION: A capillary 14 is moved toward a second bonding point 21 to form a first forming part 78 (e) by elevating the capillary 14 (d) while sending out a predetermined length of a wire after forming a neck at a first...

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Bibliographic Details
Main Author MOCHIDA TORU
Format Patent
LanguageEnglish
Korean
Published 04.03.2004
Edition7
Subjects
BASIC ELECTRIC ELEMENTS
CLADDING OR PLATING BY SOLDERING OR WELDING
CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MACHINE TOOLS
METAL-WORKING NOT OTHERWISE PROVIDED FOR
PERFORMING OPERATIONS
SEMICONDUCTOR DEVICES
SOLDERING OR UNSOLDERING
TRANSPORTING
WELDING
WORKING BY LASER BEAM
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Summary:PURPOSE: To prevent a wire loop from contacting the object in wire bonding. CONSTITUTION: A capillary 14 is moved toward a second bonding point 21 to form a first forming part 78 (e) by elevating the capillary 14 (d) while sending out a predetermined length of a wire after forming a neck at a first bonding point 20 (a), (b), (c). The capillary 14 is descended to suck a second predetermined length of the wire into the capillary 14 (f), and the capillary 14 is moved toward the opposite side of the second bonding point 21 to form a second forming part 76 (g). The capillary 14 is elevated and the wire is sent out until the first forming part 78 is located at the tip end of the capillary to retain the wire under the condition as it is (h), then the capillary 14 is moved to the second bonding point 21 to form the wire loop (i).
Bibliography:Application Number: KR20030054546