LOW VOID SPACE RESIN AND METHOD FOR PREPARING THE SAME
PURPOSE: Provided is a crosslinked polymeric bead which comprises a polymer having 0.5-2 mol% of crosslinking agent, has a diameter no greater than 200 micrometer, and has not void spaces having a diameter greater than 5 micrometer. CONSTITUTION: The bead is prepared by the method comprising the ste...
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Main Authors | , , , |
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Format | Patent |
Language | English Korean |
Published |
21.02.2004
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Edition | 7 |
Subjects | |
Online Access | Get full text |
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Summary: | PURPOSE: Provided is a crosslinked polymeric bead which comprises a polymer having 0.5-2 mol% of crosslinking agent, has a diameter no greater than 200 micrometer, and has not void spaces having a diameter greater than 5 micrometer. CONSTITUTION: The bead is prepared by the method comprising the steps of (a) preparing a suspension polymer mixture comprising (i) monomer mixture containing at least vinyl monomer and at least crosslinking agent, and (ii) 0.25-1.5 mol% of at least free radical initiator, in container, (b) injecting an inert gas into the container for sufficient time to form an atmosphere containing 5% or less of oxygen, so as to removing an oxygen from the suspension polymer mixture and the container, (c) polymerizing the monomer mixture, and (d) washing the bead with aprotic organic solvent. |
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Bibliography: | Application Number: KR20030056484 |