Multi-layer printed circuit board and method for embedding optical fiber within the same

• Main Authors: LIM, GYU HYEOK, YANG, DEOK JIN, CHO, YEONG SANG, KIM, YEONG U
• Format: Patent
• Language: English; Korean
• Published: 21.02.2004
• Edition: 7
• Subjects: CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS; OPTICS; PHYSICS; PRINTED CIRCUITS

PURPOSE: A multi-layer printed circuit board and a method for inserting an optical fiber into the multi-layer printed circuit board are provided to prevent the chemical and thermal damage by simultaneously layering at least one optical substrate and a printed circuit board. CONSTITUTION: A substrate(100) covered with a cooper foil on a surface of a dielectric substrate layer(20) is provided. At least one groove(30) is formed through a router bit process in order to insert an optical fiber(60) into the dielectric substrate layer(20) of the substrate(100). A bonding liquid(50) is applied on an inner wall of the groove(30). After the optical fiber(60) is inserted into the groove(30) applied with the bonding liquid(50), an optical substrate(200) is formed by adhering and fixing the optical fiber(60). At least one printed circuit board(300) is layered on upper and lower ends of the optical substrate(200). 본 발명은 다층 인쇄회로기판 및 광섬유를 다층 인쇄회로기판 내에 삽입하는 방법에 관한 것으로, 좀 더 상세하게는 라우트 비트 가공을 통해서 기판 내에 그루브를 형성시킨 후, 접착액을 이용하여 광섬유를 삽입, 고정시킨 적어도 하나 이상의 광학 기판과 인쇄회로기판을 함께 적층시킴으로써 화학적, 열적 손상 없이 광섬유를 다층 인쇄회로기판 내에 삽입할 수 있다.