ORGANIC SILICATE POLYMER AND INSULATION FILM COMPRISING THE SAME
PURPOSE: An organosilicate polymer, a coating composition containing the polymer for an insulating layer, an insulating layer prepared by using the composition, its preparation method and a semiconductor device containing the insulating layer are provided, to improve the mechanical properties and th...
Saved in:
Main Authors | , , , , , , , , , |
---|---|
Format | Patent |
Language | English Korean |
Published |
14.02.2004
|
Edition | 7 |
Subjects | |
Online Access | Get full text |
Cover
Loading…
Summary: | PURPOSE: An organosilicate polymer, a coating composition containing the polymer for an insulating layer, an insulating layer prepared by using the composition, its preparation method and a semiconductor device containing the insulating layer are provided, to improve the mechanical properties and the insulating property. CONSTITUTION: The organosilicate polymer is prepared mixing (a) a compound selected from the group consisting of an unsaturated organosilane, a radical reaction product of an unsaturated organosilane and their mixture, or (b) a mixture of a compound selected from the group consisting of an unsaturated organosilane, a radical reaction product of an unsaturated organosilane and their mixture and a silane compound or a silane oligomer, with an organic solvent; and adding water and a catalyst to the mixture to hydrolyze and condense it. Preferably the unsaturated organosilane is represented by SiR1pR2(4-p), wherein the each R1 is independently an alkenyl group of C1-C10; the each R2 is independently an acetoxy group, a hydroxyl group, or a straight or branched alkoxy group of C1-C4; and p is an integer of 1-4.
본 발명은 기계적 특성과 저유전성이 우수한 유기실리케이트 중합체에 관한 것으로, 특히 불포화 유기실란, 불포화 유기실란의 라디칼 반응물, 및 이들의 혼합물로 이루어지는 군으로부터 선택되는 화합물을 포함하는 유기실리케이트 중합체 및 이 유기실리케이트 중합체를 포함하는 반도체 소자의 절연막 형성용 코팅 조성물, 이 조성물이 도포되어 경화된 반도체 소자의 절연막, 및 이 절연막을 포함하는 반도체 소자에 관한 것이다. 본 발명에 따라 제조한 유기실리케이트 중합체를 적용하여 얻어지는 막은 절연성이 우수하고, 기계적 물성이 우수한 효과가 있다. |
---|---|
Bibliography: | Application Number: KR20020046331 |