Process for material-removing machining of both sides of semiconductor wafers

PURPOSE: A method for removing materials on both sides of a semiconductor wafer is provided to simultaneously remove the material on both the sides of the semiconductor wafer by placing the semiconductor wafer on a carrier that is so installed to be rotated by a circular outer driving ring and a cir...

Full description

Saved in:
Bibliographic Details
Main Authors GUIDO WENSKI, GUNTHER KANN, THOMAS ALTMANN, WOLFGANG WINKLER, GERHARD HEIER
Format Patent
LanguageEnglish
Korean
Published 16.01.2004
Edition7
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
Online AccessGet full text

Cover

More Information
Summary:PURPOSE: A method for removing materials on both sides of a semiconductor wafer is provided to simultaneously remove the material on both the sides of the semiconductor wafer by placing the semiconductor wafer on a carrier that is so installed to be rotated by a circular outer driving ring and a circular inner driving ring. CONSTITUTION: The carrier(1) moves between two operation discs rotating in opposite directions along one path curve for an upper operation disc and the other path curve for a lower operation disc. The two path curves have open appearances after six loops in its center. In each position, the path curves have at least the same radius of curvature as the radius of the inner driving ring. 본 발명은 앞면과 뒷면을 가진 반도체웨이퍼의 양면재질을 동시에 제거가공하는 방법에 관한 것이며, 여기서 반도체웨이퍼는 환상형 외부구동링 및 환상형 내부구동링에 의해 회전되게 설정된 캐리어에 놓이게 되어, 매번 상부 작업디스크에 대해 하나의 패스커브, 하부 작업디스크에 대해 하나의 패스커브에 의해 운행하는 방법으로 2개의 대향한 회전동작디스크간을 운동하게 되며, 이때 2개의 패스커브는 중심주위의 6개의 루프 다음에 열린 외관을 가지며, 각 위치에서 최소한 내부구동링의 반경과 동일 크기의 곡율반경을 가진다.
Bibliography:Application Number: KR20020039103