SYSTEM AND METHOD FOR TREATING SUBSTRATE

PURPOSE: To provide a system and method for treating substrates by which a stable flow rate of ozone gas having a stable ozone concentration can be generated even if ozone gas is fed to a plurality of chambers. CONSTITUTION: This system for treating substrates comprises an ozone gas generator 42 for...

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Bibliographic Details
Main Authors CHOUNO YASUHIRO, ITO NORIHIRO
Format Patent
LanguageEnglish
Korean
Published 07.01.2004
Edition7
Subjects
APPARATUS SPECIALLY ADAPTED THEREFOR
BASIC ELECTRIC ELEMENTS
CINEMATOGRAPHY
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
ELECTROGRAPHY
HOLOGRAPHY
MATERIALS THEREFOR
ORIGINALS THEREFOR
PHOTOGRAPHY
PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES
PHYSICS
SEMICONDUCTOR DEVICES
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Summary:PURPOSE: To provide a system and method for treating substrates by which a stable flow rate of ozone gas having a stable ozone concentration can be generated even if ozone gas is fed to a plurality of chambers. CONSTITUTION: This system for treating substrates comprises an ozone gas generator 42 for generating ozone gas by discharging in oxygen-containing gas, and a plurality of chambers 30A, 30B for separately housing substrates W. Ozone gas is fed into the chambers 30A, 30B to separately treat the substrate W. Further, the system has gas flow rate regulators 188, 191 for regulating the flow rate of the oxygen-containing gas fed to the ozone gas generator 42, and a controller 201 for controlling the gas flow rate regulators 188, 191. The total flow rate of the ozone gas fed to the plurality of the chambers 30A, 30B is controlled by controlling the flow rate of the oxygen-containing gas by the controller 201.
Bibliography:Application Number: KR20030041924