Bonding block of wire bonder

PURPOSE: A bonding block of a wire bonder is provided to be capable of restraining the delamination phenomenon of a line substrate by fixing the line substrate on the bonding block using the vacuum adsorbing force of a vacuum adsorption groove. CONSTITUTION: A bonding block of a wire bonder is provi...

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Main Authors KO, SEUNG YONG, LIM, SANG JIN, PARK, GIL HO, OH, GI TAEK, HONG, SEONG BOK
Format Patent
LanguageEnglish
Korean
Published 12.12.2003
Edition7
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:PURPOSE: A bonding block of a wire bonder is provided to be capable of restraining the delamination phenomenon of a line substrate by fixing the line substrate on the bonding block using the vacuum adsorbing force of a vacuum adsorption groove. CONSTITUTION: A bonding block of a wire bonder is provided with a plurality of vacuum adsorption holes(62) formed corresponding to semiconductor chips of the line substrate for partially adsorbing the first predetermined portion of the line substrate and a vacuum adsorption groove(64) formed around the peripheral portion of the vacuum adsorption holes for adsorbing the second predetermined portion of the line substrate. Preferably, a vacuum line(66) is formed at the inner portion of the bonding block for connecting the vacuum adsorption holes with the vacuum adsorption groove. 본 발명은 와이어 본더의 본딩 블록에 관한 것으로, 클램프와 본딩 블록에 의해 고정되는 배선기판이 본딩 블록 위로 들뜨는 것을 억제하기 위해서, 반도체 칩들이 부착된 배선기판을 고정하는 와이어 본더의 본딩 블록으로, 상기 반도체 칩들이 부착된 배선기판 부분을 진공 흡착하여 고정할 수 있도록, 상기 배선기판의 반도체 칩들에 대응되게 진공 흡착 구멍들이 형성되고, 상기 진공 흡착 구멍들에 의해 흡착된 상기 반도체 칩들 외곽의 배선기판 부분을 고정할 수 있도록, 상기 진공 흡착 구멍들의 외곽을 둘러싸는 진공 흡착 골이 형성된 와이어 본더의 본딩 블록을 제공한다.
Bibliography:Application Number: KR20020031336