1 HIGH SELECTIVE Ag ETCHANT-1

• Main Authors: KIM, GI SEOP, PARK, MIN CHUN, SONG, HYEONG SU, LEE, JAE YEON, KIM, SEONG SU
• Format: Patent
• Language: English; Korean
• Published: 10.10.2003
• Edition: 7
• Subjects: CHEMICAL SURFACE TREATMENT; CHEMISTRY; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING MATERIAL WITH METALLIC MATERIAL; COATING METALLIC MATERIAL; DIFFUSION TREATMENT OF METALLIC MATERIAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL; METALLURGY; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLICMATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASSC23 AND AT LEAST ONEPROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25; NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE

PURPOSE: A high selectivity silver(Ag) etchant is provided, which is environmentally friendly, has proper etching ratio and good side etching amount and particularly has not any IZO attack by containing a large amount of water and 1 to 10 wt.% of hydrogen peroxide. CONSTITUTION: The silver(Ag) etchant comprises 1 to 10 wt.% of hydrogen peroxide; 0.1 to 4 wt.% of pH controlling agent; 0.1 to 5 wt.% of chelator; and a balance of water, wherein the pH controlling agent is one or more salts selected from the group consisting of diammonium citrate, ammonium acetate, ammonium dihydrogen phosphate, disodium citrate, sodium acetate and sodium hydrogen phosphate, and wherein the chelator is one or more acids selected from the group consisting of acetic acid, glycol acid, citric acid, oxalic acid and malonic acid. 본 발명은 과산화수소, pH 조절제, 킬레이트화제 및 물을 포함하는 고 선택성 Ag 식각용액을 제공한다. 더 구체적으로는, 전체 조성물 총중량에 대하여 1∼10 중량% 의 과산화수소, 0.1∼4 중량% 의 pH 조절제, 0.1∼5 중량% 의 킬레이트화제, 및 전체 조성물 총중량이 100 중량% 가 되도록 하는 물을 포함하는 고 선택성 Ag 식각용액을 제공한다. 본 발명에 따른 Ag 식각용액을 사용하면, 적당한 식각률, 양호한 사이드 식각량을 제공할 수 있으며, 특히 IZO 어택이 없다는 장점이 있다.