a manufacture method of super slim ceramic package with metalic bump

PURPOSE: A method of manufacturing an ultra thin type ceramic package using a metal bump is provided to achieve an ultra thin ceramic package and reduce a fabrication cost by forming a metal bump for electrodes, not applied to the process where a middle layer including a via hole having an electrode...

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Bibliographic Details
Main Author SUN, U GYUN
Format Patent
LanguageEnglish
Korean
Published 09.08.2003
Edition7
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:PURPOSE: A method of manufacturing an ultra thin type ceramic package using a metal bump is provided to achieve an ultra thin ceramic package and reduce a fabrication cost by forming a metal bump for electrodes, not applied to the process where a middle layer including a via hole having an electrode is formed in a conventional ceramic package having less than 3 ceramic sheet. CONSTITUTION: A ceramic green sheet(202) is formed with mixing ingredients. A number of screen printing is carried out on the ceramic green sheet to form a metal bump with a metal paste of 30 micro meter. Two ceramic green sheets are stacked and partition lines is formed, and then sintering is carried out on it. Plating is carried out to plate the metal bump(502) with Ni-Au. 본 발명은 세라믹 패키지의 제조방법에 관한 것으로, 더욱 상세하게는 재료를 믹싱(10)해서 크림상태로 만든 후 닥터블레이드로 형상화하여 세라믹 그린 시트(ceramic green sheet)를 형성(20)하는 1공정(100); 하층의 세라믹 그린 시트(ceramic green sheet) 상면에 수회에 걸쳐 스크린 프린팅 작업을 행해 메탈 페이스트(metal paste)가 두께가 30㎛로 된 메탈 범프를 형성하는 2공정(30); 2장의 세라믹 그린 시트(ceramic green sheet)를 적층(60)시키고 구획선을 형성(70)하여 소결(80)시키는 3공정(200); 상기 메탈 범프에 니켈 또는 니켈-금 도금을 시키는 플레이팅을 실시하는 4공정(300);으로 이루어지는 것으로, 세라믹 패키지를 초박형화하고, 제조공정을 단순화시켜 제조원가를 절감할 수 있도록 한 유용한 효과를 제공한다.
Bibliography:Application Number: KR20020006041