Method for forming grooves and Semiconductor device elongated effective channel length and/or width using the same

PURPOSE: A method for forming a groove for a semiconductor device and a semiconductor device extended effective channel length and/or width using the same are provided to increase the effective channel length without applying any stress to the semiconductor substrate by forming a plurality of groove...

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Bibliographic Details
Main Author SON, NAK JIN
Format Patent
LanguageEnglish
Korean
Published 18.04.2003
Edition7
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Summary:PURPOSE: A method for forming a groove for a semiconductor device and a semiconductor device extended effective channel length and/or width using the same are provided to increase the effective channel length without applying any stress to the semiconductor substrate by forming a plurality of grooves at the semiconductor substrate without using a minute nitride film pattern. CONSTITUTION: A photoresist pattern is formed at the appropriate place of a semiconductor substrate(100) where the MOS transistor region is defined. Ion implantation is made with respect to the exposed semiconductor substrate(100) using the photoresist pattern as a mask. The photoresist pattern is removed. The resulting semiconductor substrate(100) is thermally oxidized to form a thermal oxidation layer. The thermal oxidation layer is removed to thereby form grooves(H) in a selective manner. 본 발명은 반도체 소자의 홈 형성방법 및 이를 이용한 유효 채널 길이 및/또는 폭이 연장된 반도체 소자를 개시한다. 개시된 본 발명은, 먼저, 모스 트랜지스터 영역이 한정된 반도체 기판의 적소에 포토레지스트 패턴을 형성한다. 그후, 상기 포토레지스트 패턴을 마스크로 하여, 노출된 반도체 기판에 소정의 이온을 주입한다음, 상기 포토레지스트 패턴을 제거한다. 이어서, 반도체 기판 결과물을 열산화시킨후, 상기 열산화로 발생된 열산화막을 제거하여, 선택적으로 홈을 형성한다.
Bibliography:Application Number: KR20010062155