air exhaust system of chamber for semiconductor manufacture

• Main Authors: KO, BU JIN, HAN, SUN SEOK, KIM, JEONG SIK
• Format: Patent
• Language: English; Korean
• Published: 18.04.2003
• Edition: 7
• Subjects: BASIC ELECTRIC ELEMENTS; CHEMICAL SURFACE TREATMENT; CHEMISTRY; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING MATERIAL WITH METALLIC MATERIAL; COATING METALLIC MATERIAL; DIFFUSION TREATMENT OF METALLIC MATERIAL; ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL; METALLURGY; SEMICONDUCTOR DEVICES; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION

PURPOSE: An exhaust system of a chamber for semiconductor fabrication is provided to effectively prevent non-uniformity in the exhaust pressure and non-equality in the wafer processing by granting uniform exhaust pressure to the chamber. CONSTITUTION: A chuck(130) is used for passing through centrally the bottom(120a) of a chamber(120) while standing substantially vertical to the chamber(120). A plurality of opening portions(124a,124b) are formed at the bottom(120a) of the chamber(120) around the chuck(130) while taking the same area and being spaced apart from each other by the same distance. A plurality of exhaust tubes(125a) are connected to the opening portions(124a) with the same sectional area and the same length. A buffer(151) is used for interconnecting the opposite-ends of the exhaust tubes(125a). A gate value(152) is connected to the buffer(151). A pressure controller(154) is connected to the gate valve(152). A turbo pump(156) is connected to the pressure controller(154) to extract the gas from the chamber(120). A cleaner(158) is connected to the turbo pump(156) to clean the gas within the chamber(120) and discharge the cleaned gas to the outside. 본 발명은 반도체 제조용 챔버에 부설되는 배기 시스템에 관한 것으로, 챔버와; 상기 챔버의 저면 중앙을 관통하여, 실질적으로 수직하게 설치되는 척과; 상기 척의 주위를 따라, 상기 챔버의 저면 상에 동일한 면적을 가지고 동일간격으로 관통 배열된 다수의 개구부와; 동일한 단면적과 길이를 가지고, 일단이 상기 다수의 개구부에 각각 연결되는 다수의 배기관과; 상기 다수의 배기관의 타단을 하나로 연결하는 버퍼장치와; 상기 버퍼장치와 연결되는 게이트 밸브와; 상기 게이트 밸브에 연결되는 압력조절기와; 상기 압력조절기에 연결되어 상기 챔버의 내부 기체를 뽑아내는 터보펌프와; 상기 터보펌프에 연결되어 상기 챔버 내부의 기체를 세정하여 외부로 방출하는 세정기를 포함하는 반도체 제조용 챔버의 배기시스템을 제공한다.