Method for forming a thin film pattern
PURPOSE: A method of patterning a thin film is provided to simplify a fabricating process by removing a composition process of an etching solution as well as an exposure process and a development process of photoresist from an existing printing method or an existing photolithography method. CONSTITU...
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Main Authors | , , , |
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Format | Patent |
Language | English Korean |
Published |
14.04.2003
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Edition | 7 |
Subjects | |
Online Access | Get full text |
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Summary: | PURPOSE: A method of patterning a thin film is provided to simplify a fabricating process by removing a composition process of an etching solution as well as an exposure process and a development process of photoresist from an existing printing method or an existing photolithography method. CONSTITUTION: A pattern based on an organic material is formed on an upper surface of a substrate by using a printing method. A thin film is formed on the surface of the substrate overlaid with the organic material pattern by way of a film formation material. The thin film is stripped from the organic material pattern through dissolving the organic material pattern using an organic solvent. The printing method is a thick film printing method or an ink-jet printing method.
본 발명은 (a) 기판 상부에 인쇄법을 이용하여 유기물의 패턴을 형성하는 단계; (b) 상기 패턴 상에 막 형성용 물질로 박막을 형성하는 단계; 및 (c) 유기용매를 사용하여 (a)단계에서 형성된 패턴 용해시켜 패턴 및 패턴 상에 형성된 막 형성 물질의 박막층을 스트리핑하는 단계를 포함하는 박막 패터닝 방법을 제공한다. 상기 박막 패터닝 방법은 막 형성을 필요로 하는 모든 장치, 예를 들면, 형광표시관(VFD), 브라운관(CRT), 전계방출표시소자(FED), 플라즈마 디스플레이패널 (PDP) 등에 적용될 수 있다. |
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Bibliography: | Application Number: KR20010061638 |