Porous materials

PURPOSE: A porous dielectric material, its preparation method, an integrated circuit containing the porous dielectric material and an electronic device containing the porous dielectric layer are provided, wherein dielectric material is useful for manufacturing an electronic device. CONSTITUTION: The...

Full description

Saved in:
Bibliographic Details
Main Authors YOU YUJIAN, GALLAGHER MICHAEL K, LAMOLA ANGELO A, GORE ROBERT H
Format Patent
LanguageEnglish
Korean
Published 30.11.2002
Edition7
Subjects
Online AccessGet full text

Cover

Loading…
More Information
Summary:PURPOSE: A porous dielectric material, its preparation method, an integrated circuit containing the porous dielectric material and an electronic device containing the porous dielectric layer are provided, wherein dielectric material is useful for manufacturing an electronic device. CONSTITUTION: The porous dielectric material is a closed cell dielectric material containing a plurality of pores, and its porosity is 30 % or more. Preferably the dielectric material is selected from the group consisting of an inorganic matrix material comprising carbides, oxides, nitrides and oxyfluorides of silicon, boron or aluminium; silicone; siloxane; an organic polysilica material; silicate; silazane; and benzocyclobutene, poly(aryl ester), poly(ether ketone), polycarbonate, polyimide, fluorinated polyimide, polynorbornene, poly(arylene ether), polyaromatic hydrocarbon, polyquinoxaline, poly(perfluorinated hydrocarbon) and polybenzoxazole. 본 발명은, 저유전상수, > 30%의 기공률 및 밀폐 셀(closed cell) 기공 구조를 가진 다공성 유전체 물질을 이 물질을 제조하는 방법과 함께 개시한다. 이러한 물질은 특히 전자 디바이스의 제조시 특히 적합하다.
Bibliography:Application Number: KR20020026647