Method of grey level compensation and selective wafer-defect inspection for patterns and recording medium recorded thereof

• Main Authors: RYU, SEONG GON, JUN, CHUNG SAM, JUN, SANG MUN, LEE, DONG CHUN, CHOI, SANG BONG, KIM, HYEONG JIN
• Format: Patent
• Language: English; Korean
• Published: 18.11.2002
• Edition: 7
• Subjects: BASIC ELECTRIC ELEMENTS; CALCULATING; COMPUTING; COUNTING; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; IMAGE DATA PROCESSING OR GENERATION, IN GENERAL; INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIRCHEMICAL OR PHYSICAL PROPERTIES; MEASURING; PHYSICS; SEMICONDUCTOR DEVICES; TESTING

PURPOSE: A method of grey level compensation and selective wafer-defect inspection for patterns and recording medium recorded thereof are provided to compensate different brightness of each parts of a wafer, detect selective defects for different patterns, and form a recoding medium for recording a method for correcting the brightness and a method for detecting the selective defects. CONSTITUTION: A surface of a wafer including an X region having the first brightness and a Y region having the second brightness is divided into a plurality of pixels having a predetermined size. Gray level values for each pixel are defined. A mean value and standard deviation of the gray level values of each region are obtained according to the X region and the Y region. The mean value and the standard deviation of the gray level values for the X region is identical with the mean value and the standard deviation of the gray level values for the Y region by performing a correction process for correcting the gray level values for all pixels of the X region. 웨이퍼 표면의 명도를 보정하는 방법 및 서로 다른 패턴에 대한 선택적 결함 검출 방법, 그리고 이러한 방법들을 기록한 기록 매체에 관해 개시한다. 웨이퍼를 분할하는 각 픽셀들의 평균과 표준 편차를 이용함으로써, 명도차가 있는 이미지들의 명도를 보정할 수 있다. 또한, 금속 배선 패턴과 스페이스를 구별하여, 각 패턴에 대해 서로 다른 임계값을 적용함으로써, 선택적으로 결함을 검출할 수 있다. 즉, 그레인은 검출하지 않고, 반도체 소자에 치명적인 영향을 주는 브리지만 검출할 수 있다. 따라서, 결함 검출의 선별력이 향상되므로, 결함 검출 공정을 더 효율적으로 관리할 수 있다.