APPARATUS AND METHOD FOR COLLECTING POLLUTANTS OF SEMICONDUCTOR WAFER

• Main Authors: HUH, YONG U, KIL, JUN ING, LEE, MI GYEONG, CHO, HYEON GI
• Format: Patent
• Language: English; Korean
• Published: 04.10.2002
• Edition: 7
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIRCHEMICAL OR PHYSICAL PROPERTIES; MEASURING; PHYSICS; SEMICONDUCTOR DEVICES; TECHNICAL SUBJECTS COVERED BY FORMER USPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ARTCOLLECTIONS [XRACs] AND DIGESTS; TESTING

PURPOSE: An apparatus and a method for collecting pollutants of a semiconductor wafer are provided to collect a pollution source from a surface of a wafer by scanning automatically a surface of a semiconductor wafer. CONSTITUTION: A process chamber(100) has a shape of rectangular parallelepiped. A transfer unit(700) is used for transferring a wafer(50) of a loader portion(200) to a vapor phase deposition unit(300), a scanning unit(400), a dry unit(500), and an unloader portion(600). The loader portion(200) and the unloader portion(600) are installed at one side and the other side of the process chamber(100), respectively. The loader portion(200) and the unloader portion(600) have wafer cassettes for loading wafers(50). The vapor phase deposition unit(300) is formed with a loading plate(350), an airtight container(310), and a hydrofluoric acid tank. The scanning unit(400) is installed between the vapor phase deposition unit(300) and the unloader portion(600).