AUTOMATICALLY SEQUENTIAL WAFER PROCESS SYSTEM AND METHOD FOR PROCESSING WAFER USING THE SAME

PURPOSE: An automatically sequential wafer process system and a method for processing a wafer using the same are provided to reduce an area of process modules of a production line by forming a plurality of process modules with one body. CONSTITUTION: A wafer distribution tower(30) has a plurality of...

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Bibliographic Details
Main Authors BAE, JANG HO, PARK, YEONG HUN, KYUNG, HYEON SU, CHOI, CHANG HWAN, BAEK, CHUN GEUM, LIM, HONG JU
Format Patent
LanguageEnglish
Korean
Published 28.09.2002
Edition7
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:PURPOSE: An automatically sequential wafer process system and a method for processing a wafer using the same are provided to reduce an area of process modules of a production line by forming a plurality of process modules with one body. CONSTITUTION: A wafer distribution tower(30) has a plurality of distribution paths. A plurality of process modules(100b,100c,100d,100e,100f) are installed in a polygon module unit(10). Tow load lock units corresponding to the distribution paths are installed between the polygon module unit(10) and the wafer distribution tower(30). The wafer distribution tower(30) is used for transferring the wafer between a plurality of poops installed to the wafer to the load lock units and the first and the second load port module(36,37). The load lock units are used for transferring the wafer between the wafer distribution tower(30) of a standby state and the polygon module unit(10).
Bibliography:Application Number: KR20010013890