AUTOMATIC CONTINUOUS WAFER PROCESSING SYSTEM AND METHOD FOR PROCESSING WAFER USING THE SAME

PURPOSE: An automatic continuous wafer processing system and a method for processing a wafer using the same are provided to reduce an area of processing modules in a production line by forming the processing modules with one body. CONSTITUTION: A plurality of track modules(10,20) have a track body,...

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Main Authors BAE, JANG HO, PARK, YEONG HUN, KYUNG, HYEON SU, CHOI, CHANG HWAN, BAEK, CHUN GEUM, LIM, HONG JU
Format Patent
LanguageEnglish
Korean
Published 16.09.2002
Edition7
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:PURPOSE: An automatic continuous wafer processing system and a method for processing a wafer using the same are provided to reduce an area of processing modules in a production line by forming the processing modules with one body. CONSTITUTION: A plurality of track modules(10,20) have a track body, a plurality of processing modules for processing wafers, and a track robot for transferring the wafers to the processing modules, respectively. A wafer division tower(30) includes a tower body having division paths, an aligner fixed to an inside of the tower body, and an elevation robot for elevating the wafers from the aligner to each place corresponding to the division paths. A plurality of load lock units(40) are installed between the track modules(10,20) and the wafer division tower(30) in order to store the wafers, temporarily and separate the wafer division tower(30) from the track modules(10,20). The number of the track modules(10,20) is equal to the number of the load lock units(40).
Bibliography:Application Number: KR20010012438