THIN FILM TRANSISTOR SUBSTRATE AND PROCESS FOR PRODUCING THE SAME

PURPOSE: To solve the problem of the characteristics of a thin-film transistor becoming ununiform, because the amount of regression due to the side-etch varies when a Mo-W alloy film which is to become the gate of the thin-film transistor is processed with wet-etching method which ensures superior p...

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Main Authors SATOU TAKESHI, KATOU TOMOYA, TAKAHASHI TAKUYA, KANEKO TOSHIKI, IKEDA HAJIME
Format Patent
LanguageEnglish
Korean
Published 14.09.2002
Edition7
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Summary:PURPOSE: To solve the problem of the characteristics of a thin-film transistor becoming ununiform, because the amount of regression due to the side-etch varies when a Mo-W alloy film which is to become the gate of the thin-film transistor is processed with wet-etching method which ensures superior productivity. CONSTITUTION: In a polycrystalline Si thin-film transistor substrate having a self-aligned LDD, the Mo-W alloy in a concentration of W from 5 wt.% to 30 wt.%, more desirably from 17 wt.% to 22 wt.% is used for the gate and a substrate is formed containing the process through wet etching which uses an echant having the phosphoric acid in the concentration range of 60 wt.% to 70 wt.%. 자기 정합 LDD를 갖는 다결정 Si 박막 트랜지스터 기판에서, 게이트에 W 농도가 5wt% 이상 25wt% 미만, 보다 바람직하게는 17wt% 내지 22wt%의 Mo-W 합금을 이용하여, 인산 농도를 60wt% 내지 70wt%의 에칭액을 이용한 웨트 에칭에 의한 공정을 포함하는 방법으로 형성된 박막 트랜지스터 기판은 균일한 특성을 가지며 생산성도 우수하다.
Bibliography:Application Number: KR20010052475