POLYIMIDE BASED COPOLYMER

PURPOSE: Provided are a polyimide based copolymer having high solubility and excellent adhesion, a method for producing the same, an insulating film composition having controlled dielectric constant, and a method for producing the insulating film. CONSTITUTION: The polyimide based copolymer comprise...

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Bibliographic Details
Main Authors HWANG, YUN IL, KIM, GWANG GYU, KIM, GYEONG JUN
Format Patent
LanguageEnglish
Korean
Published 19.08.2002
Edition7
Subjects
CHEMISTRY
COMPOSITIONS BASED THEREON
MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
METALLURGY
ORGANIC MACROMOLECULAR COMPOUNDS
THEIR PREPARATION OR CHEMICAL WORKING-UP
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Summary:PURPOSE: Provided are a polyimide based copolymer having high solubility and excellent adhesion, a method for producing the same, an insulating film composition having controlled dielectric constant, and a method for producing the insulating film. CONSTITUTION: The polyimide based copolymer comprises a compound represented by formula 1, a compound represented by formula 2, and a compound represented by formula 3. In the formulae, each of l, m and n represents an integer of 1-500. The polyimide based copolymer has intrinsic viscosity of 0.3-0.5 dl/g, and glass transition temperature of 300-370 deg.C. The polyimide based copolymer is prepared by the steps of (i) dissolving a compound of formula 1, a compound of formula 2, and a compound of formula 3 in solvent to form a solution of amic acid; and (ii) heating the solution to condensation react the solution.
Bibliography:Application Number: KR20010006730