PAPER CARRIER TAPE MANUFACTURING METHOD

• Main Authors: YOSHIHARA TAKAO, CHIBA MINORU, SAITO AKIRA, OKAMURA MATSUO
• Format: Patent
• Language: English; Korean
• Published: 29.07.2002
• Edition: 7
• Subjects: ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS,e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES,DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; CONVEYING; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; HANDLING THIN OR FILAMENTARY MATERIAL; MACHINES, APPARATUS OR DEVICES FOR, OR METHODS OF, PACKAGINGARTICLES OR MATERIALS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PACKAGES; PACKAGING ELEMENTS; PACKING; PERFORMING OPERATIONS; PRINTED CIRCUITS; STORING; TRANSPORTING; UNPACKING

PURPOSE: To provide a paper carrier tape manufacturing method in which a chip accommodation recess is formed with excellent accuracy, a part of a bottom part of the chip accommodation recess has appropriate strength against protrusion of a push-out pin, and the chip accommodation recess is machined so as not to have any hole in the bottom part thereof. CONSTITUTION: In a first step, a through hole 2 is made in a paper carrier tape base material 1a, in a second step, a punch 5 is pressed against the through hole 2 to form the chip accommodation recess 3 over the through hole 2 in the paper carrier tape base material 1a, and the through hole 2 is closed by a part of the paper carrier tape base material 1a. Thus, the paper carrier tape 1 is manufactured. Since the paper carrier tape 1 is manufactured via the first and second steps, the chip accommodation recess 3 is formed with excellent accuracy, and no hole is made in the bottom part of the chip accommodation recess 3, but it is easily opened. 제 1 공정에서 지제(紙製) 캐리어 테이프 기재(基材)(1a)에 관통구멍(2)이 개구되고, 그 후, 제 2 공정에서 펀치(5)를 관통구멍(2) 위에 덮어 누름으로써, 지제 캐리어 테이프 기재(1a)의 관통구멍(2) 위에 칩 수납 오목부(3)를 성형하는 동시에, 지제 캐리어 테이프 기재(1a)의 일부에 의해 관통구멍(2)을 폐쇄한다. 이와 같이 하여 지제 캐리어 테이프(1)는 제조된다. 이와 같이 지제 캐리어 테이프(1)는 제 1 공정 및 제 2 공정을 거쳐 제조되기 때문에, 칩 수납 오목부(3)는 양호한 정밀도로 성형되고, 칩 수납 오목부(3)의 저부가 구멍을 갖지는 않으나, 간단하게 개구할 수 있다.