METHOD FOR FORMING PREALIGN MARK FOR SCANNER ON WAFER

PURPOSE: A method for forming the prealign(PA) mark for scanner on a wafer is provided to improve the yield and the throughput of products by improving the accuracy of prealign. CONSTITUTION: A normal exposure region(21) is disposed in an exposure mask(20) for the PA mark formation. An exposure regi...

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Bibliographic Details
Main Authors NAM, YONG U, JUNG, JAE GWAN
Format Patent
LanguageEnglish
Korean
Published 11.07.2002
Edition7
Subjects
APPARATUS SPECIALLY ADAPTED THEREFOR
BASIC ELECTRIC ELEMENTS
CINEMATOGRAPHY
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
ELECTROGRAPHY
HOLOGRAPHY
MATERIALS THEREFOR
ORIGINALS THEREFOR
PHOTOGRAPHY
PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES
PHYSICS
SEMICONDUCTOR DEVICES
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Summary:PURPOSE: A method for forming the prealign(PA) mark for scanner on a wafer is provided to improve the yield and the throughput of products by improving the accuracy of prealign. CONSTITUTION: A normal exposure region(21) is disposed in an exposure mask(20) for the PA mark formation. An exposure region(22) for PA mark formation is disposed around the normal exposure region(21). The most outside(23) of the exposure region(22) is treated with chromium. A designed PA mark(24) can be inserted in the exposure region(22) for PA mark formation in order to form a pattern of the PA mark(24) formed by the combination of bars, on the position corresponding to the position of a PA key on the wafer. The pattern of the PA mark(24) is formed along the surrounding of a chip which is not formed on the wafer(25) by exposing the pattern of the PA mark(24) on the wafer with use of mask(20) for the PA mark formation(20).
Bibliography:Application Number: KR20010000629