LEAF COATER AND METHOD FOR PRODUCING A LEAF TYPE COATED SUBSTRATES

PURPOSE: Provided are a leaf coater and a method for producing leaf type coated substrates, which allow the production of coated substrates excellent in the uniformity of the film thickness of an applied coating material. CONSTITUTION: The leaf coater(1) comprises (a) a coating solution supply sourc...

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Bibliographic Details
Main Authors KAWATAKE HIROSHI, KOBAYASHI HIROFUMI, TSUJII MASAYA, HASHIMOTO KAZUYUKI, TOMIMATSU SHINJI
Format Patent
LanguageEnglish
Korean
Published 18.04.2002
Edition7
Subjects
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Summary:PURPOSE: Provided are a leaf coater and a method for producing leaf type coated substrates, which allow the production of coated substrates excellent in the uniformity of the film thickness of an applied coating material. CONSTITUTION: The leaf coater(1) comprises (a) a coating solution supply source(12), (b) a predetermined coating solution quantity intermittent supply means(16), (c) a coating solution applying means for applying a coating solution to each blank substrate(18), (d) a first coating solution flow pipeline connecting said coating solution supply source with said predetermined coating solution quantity intermittent supply means, (e) a second coating solution flow pipeline(22) connecting said predetermined coating solution quantity intermittent supply means with said coating solution applying means, and (f) a coating solution filtration means(23) provided in either said first or second coating solution flow pipeline, which comprises a housing having an inlet(23a) and an outlet(23b) of the coating solution and a coating solution filtration means composed of a filter medium(24) provided in the passage of the coating solution in said housing, wherein the Young's modulus of the filter medium in said coating solution filtration means is not less than 200 MPa and the pore size of the filter medium is in the range of 0.05 to 100 micrometer. 소정량의 도포액 단속 공급수단 및 블랭크 기판을 도포액으로 하나씩 도포하기 위한 블랭크 기판에 대한 도포액 도포수단을 통하여, 도포액 공급원으로부터 일정량의 도포액을 단속적으로 공급하고, 상기 도포액 공급원으로부터 도포액 도포수단까지의 도포액 유동 파이프라인 내에 도포액 여과수단이 설치되어 있으며, 상기 여재의 공극크기가 0.05~100㎛이고, 상기 도포액 여과수단내의 여재의 탄성계수가 200MPa 이상인 것을 특징으로 하는 리프코터와, 이 리프코터를 사용하여 도포기판을 제조하기 위한 방법을 제공한다.
Bibliography:Application Number: KR20010063110