Antireflective porogens

• Main Authors: GALLAGHER MICHAEL K, ZAMPINI ANTHONY
• Format: Patent
• Language: English; Korean
• Published: 17.04.2002
• Edition: 7
• Subjects: ADHESIVES; APPARATUS SPECIALLY ADAPTED THEREFOR; BASIC ELECTRIC ELEMENTS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; CHEMICAL PAINT OR INK REMOVERS; CHEMISTRY; CINEMATOGRAPHY; COATING COMPOSITIONS, e.g. PAINTS, VARNISHES ORLACQUERS; COMPOSITIONS BASED THEREON; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS; CORRECTING FLUIDS; DYES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; ELECTROGRAPHY; FILLING PASTES; HOLOGRAPHY; INKS; MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVINGCARBON-TO-CARBON UNSATURATED BONDS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; MATERIALS THEREFOR; METALLURGY; MISCELLANEOUS APPLICATIONS OF MATERIALS; MISCELLANEOUS COMPOSITIONS; NATURAL RESINS; ORGANIC MACROMOLECULAR COMPOUNDS; ORIGINALS THEREFOR; PAINTS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; PHOTOGRAPHY; PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES; PHYSICS; POLISHES; PRINTED CIRCUITS; SEMICONDUCTOR DEVICES; THEIR PREPARATION OR CHEMICAL WORKING-UP; USE OF MATERIALS THEREFOR; WOODSTAINS

PURPOSE: Provided are organo polysilica dielectric materials having low dielectric constants useful in electronic component manufacture along with methods of preparing the porous organo polysilica dielectric materials. Also, provided are methods of forming electronic devices containing such porous organo polysilica dielectric materials without the use of antireflective coatings. CONSTITUTION: The composition useful for forming porous organo polysilica dielectric material, comprises removable porogen, wherein the porogen comprises one or more chromophores. The one or more chromophores(formula 1) are selected from monomers containing phenyl, substituted phenyl, naphthyl, substituted naphthyl, anthracenyl, substituted anthracenyl, phenanthrenyl, substituted phenanthrenyl, and one or more (C4-C24)alkyl groups. In the formula 1, R is H or CH3, and R is selected from phenyl, benzyl, the formula (a). 다공성 유기 폴리실리카 유전물질을 제조하는 방법과 함께 전자 부품의 제조에 유용한 낮은 유전상수를 가진 유기 폴리실리카 유전물질이 개시된다. 또한 반사방지 코팅을 사용하지 않고 이러한 다공성 유기 폴리실리카 유전물질을 함유한 전자 디바이스(electronic device)를 형성하는 방법이 개시된다.