SPRAYING PHOTORESIST APPLICATOR

PURPOSE: A spraying photoresist applicator is provided to prevent a layering of thin film of photoresist, even though the photoresist film is formed on wafer thinly or thickly. CONSTITUTION: The applicator comprises wafer chuck(220), at which wafer is arrived, and photoresist supplying device(300)....

Full description

Saved in:
Bibliographic Details
Main Author LEE, MYEONG GYU
Format Patent
LanguageEnglish
Korean
Published 16.04.2002
Edition7
Subjects
APPARATUS SPECIALLY ADAPTED THEREFOR
BASIC ELECTRIC ELEMENTS
CINEMATOGRAPHY
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
ELECTROGRAPHY
HOLOGRAPHY
MATERIALS THEREFOR
ORIGINALS THEREFOR
PHOTOGRAPHY
PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES
PHYSICS
SEMICONDUCTOR DEVICES
Online AccessGet full text

Cover

More Information
Summary:PURPOSE: A spraying photoresist applicator is provided to prevent a layering of thin film of photoresist, even though the photoresist film is formed on wafer thinly or thickly. CONSTITUTION: The applicator comprises wafer chuck(220), at which wafer is arrived, and photoresist supplying device(300). The photoresist supplying device comprises a tank for storing a photoresist; a pumping unit(320) for pumping the photoresist supplied from the tank with predesignated pressure; and a spraying nozzle for atomizing the pumped photoresist into particle and supplying the particle to the wafer.
Bibliography:Application Number: KR20000059076