METHOD FOR CONVERTING RECLAIM WAFER INTO SEMICONDUCTOR WAFER

PURPOSE: A method for converting a reclaim wafer into a semiconductor wafer is provided to convert the reclaim wafer into a semiconductor wafer which is suitable for a starting material used to fabricate an electronic device having a line width of 0.13 micrometer or lower. CONSTITUTION: At least one...

Full description

Saved in:
Bibliographic Details
Main Author WENSKI GUIDO
Format Patent
LanguageEnglish
Korean
Published 07.03.2002
Edition7
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
Online AccessGet full text

Cover

More Information
Summary:PURPOSE: A method for converting a reclaim wafer into a semiconductor wafer is provided to convert the reclaim wafer into a semiconductor wafer which is suitable for a starting material used to fabricate an electronic device having a line width of 0.13 micrometer or lower. CONSTITUTION: At least one foreign-material-bearing surface of the reclaim wafer is removed. The surface material is removed from at least one of the surfaces and/or the edge of the reclaim wafer by using at least one etching step. The edge of the reclaim wafer is polished. The surfaces of the reclaim wafer between rotating polishing plates are simultaneously polished. A single-side polishing process is performed regarding at least one surface of the reclaim wafer on a polishing plate.
Bibliography:Application Number: KR20010019239