THE TOUCH PANEL METHOD FOR MANUFACTURING THE SAME AND SCREEN INPUT TYPE DISPLAY UNIT USING THE SAME

• Main Authors: CHIBA SHINSAKU, FURUHASHI SHOJI, ISHII KAZUO, YOSHIDA KAZUTOSHI, MAJIMA KAZUO, SUZUKI SHIGEKI, KONDOU YASUAKI
• Format: Patent
• Language: English; Korean
• Published: 09.01.2002
• Edition: 7
• Subjects: BASIC ELECTRIC ELEMENTS; CALCULATING; COMPUTING; COUNTING; ELECTRIC DIGITAL DATA PROCESSING; ELECTRIC SWITCHES; ELECTRICITY; EMERGENCY PROTECTIVE DEVICES; PHYSICS; RELAYS; SELECTORS

PURPOSE: A touch panel, a method for manufacturing the same, and a screen input type display unit using the same are provided to detect input coordinates through a change of resistance caused by depression or depress operation. CONSTITUTION: An upper wiring electrodes(5A, 5B) are provided in the left/right-direction and on the opposite end portions of the upper resistance film(3) formed on the inner surface of the upper substrate(1). The lower wiring electrodes 6A and 6B are provided in the up/down-direction and on the opposite end portions of the lower resistance film(4) formed in the inner surface of the lower substrate(2). The upper wiring electrodes(5A, 5B) are electrically connected to inter-substrate connection electrodes(7A, 7B) formed on the lower substrate(2), respectively. The connection is performed through conductive paste(8CH, 8DH) provided to penetrate the adhesive materials(8C, 8D) partially. The upper wiring electrode leading wire(11A) drawn out from the inter-substrate connection electrode(7A) and the upper wiring electrode leading wire(11B) drawn out from the inter-substrate connection electrode(7B) are drawn out to the connection region(10) of the output printed board(12). The upper wiring electrode leading wires(11C, 11D) drawn out from the lower wiring electrodes(6A, 6B) connected to the lower resistance film(4) respectively are also drawn out to the connection region(10) of the output printed board(12). 상부 저항막을 포함하는 연질 필름 부재의 상부 기판과 하부 저항막을 포함하는 경질판의 하부 기판을 접합하는 단계를 포함하며, 상부 기판과 하부 기판을 연속하여 절단하는 터치 패널의 제조 방법이 제공된다.