SHOWERHEAD WITH REDUCED CONTACT AREA

• Main Authors: ZHENG BO, VO BEVAN, KAO CHIEN-TEH, CHANG ANZHONG, LITTAU KARL A, LU SIQING, JIAN PING, UMOTOY SALVADOR P, LAI KEN KAUNG, TRINH SON N
• Format: Patent
• Language: English; Korean
• Published: 05.01.2002
• Edition: 7
• Subjects: APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL; ATOMISING APPARATUS; BASIC ELECTRIC ELEMENTS; CHEMICAL SURFACE TREATMENT; CHEMISTRY; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING MATERIAL WITH METALLIC MATERIAL; COATING METALLIC MATERIAL; DIFFUSION TREATMENT OF METALLIC MATERIAL; ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL; METALLURGY; NOZZLES; PERFORMING OPERATIONS; SEMICONDUCTOR DEVICES; SPRAYING APPARATUS; SPRAYING OR ATOMISING IN GENERAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; TRANSPORTING

PURPOSE: A showerhead with reduced contact area is provided to distribute gases in a semiconductor process chamber. CONSTITUTION: In one embodiment, a showerhead(118) comprising a perforated center portion(214), a mounting portion(202) circumscribing the perforated center portion and a plurality of bosses(210) extending from the mounting portion each having a hole disposed therethrough is provided. Another embodiment of the invention provides a showerhead that includes a mounting portion(202) having the first side circumscribing a perforated center portion(214). A ring(304) extends from the first side of the mounting portion. A plurality of mounting holes(306) are disposed in the mounting portion radially to either side of the ring. The showerhead provides controlled thermal transfer between the showerhead and chamber lid resulting in less deposition on the showerhead. 반도체 프로세스 챔버에서 가스를 배분하기 위한 샤워헤드. 실시예의 한가지로서, 관통된 중심부, 관통된 중심부를 둘러싸고 있는 장착부와 관통되어 배치된 구멍을 가진 각각의 장착부로부터 연장된 다수 개의 보스를 포함하는 샤워헤드가 제공된다. 본 발명의 또 다른 실시예는 관통된 중심부를 둘러싸는 제 1 측부를 가진 장착부를 포함하는 샤워헤드를 제공한다. 링은 상기 장착부의 제 1 측부로부터 연장된다. 다수 개의 마운팅 구멍들은 상기 링의 어느 한 측부에 반경 상으로 장착부에 배치된다. 샤워헤드는 샤워헤드와 챔버 리드 사이에 제어된 열 전달을 제공하여 샤워헤드 상에 적은 증착을 일으킨다.