SEMICONDUCTOR APPARATUS CONNECTING BONDING PAD OF CHIP AND LEAD OF LEAD FRAME NOT USING CONNECTING WIRE

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Bibliographic Details
Main Author JO, JAE-WON
Format Patent
LanguageEnglish
Published 15.09.1999
Edition6
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Bibliography:Application Number: KR19940010585U