SEMICONDUCTOR DEVICE AND METHOD OF PRODUCING THE SAME AND SEMICONDUCTOR CHIP AND METHOD OF PRODUCING THE SAME

• Main Authors: HOZUMI DAKASHI, FUKASAWA NORIO, KAWAHARA TOSHIMI
• Format: Patent
• Language: English; Korean
• Published: 07.11.2001
• Edition: 7
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

PURPOSE: A semiconductor device is provided to improve bonding force between a semiconductor chip and sealing resin in an exposed part and to prevent the sealing resin from being delaminated from the semiconductor chip, by forming the exposed part where the semiconductor chip is exposed while using laser. CONSTITUTION: The semiconductor chip(32A) has an outer terminal(33). The sealing resin(35A) is formed on a surface where the outer terminal of the semiconductor chip is formed, sealing the surface of a protrusion electrode except a part of the outer terminal. A layer of contaminant(48) is formed on the surface where the outer terminal of the semiconductor chip is formed. The outer circumferential portion of the contaminant is eliminated so that the exposed part(36) to which the semiconductor chip is exposed is formed and the sealing resin is bonded to the exposed part. 본 발명은 반도체 칩 상에 밀봉 수지가 배설되는 칩 사이즈 패키지구조를 갖는 반도체 장치 및 그 제조 방법 및 반도체 칩 및 그 제조 방법에 관한 것이며, 반도체 칩 및 밀봉 수지에 균열이나 깨짐의 발생을 방지하는 것을 과제로 한다. 외부 단자(33)가 형성된 반도체 칩(32A)과, 이 반도체 칩(32A)의 회로형성면 측에 형성된 밀봉 수지(35A)를 구비하고, 반도체 칩(32A)의 상면(회로형성면)에 오염물(48)의 막이 존재하는 반도체 장치에 있어서, 오염물(48)의 외주부분을 레이저가공으로 제거함으로써 반도체 칩(32A)이 노출하는 노출부(36)를 형성하여, 주로 밀봉 수지(35A)가 이 노출부(36)에 접합하도록 구성한다.