Electronic circuit device

PURPOSE: To provide an electronic circuit device which can readily be detached without adversely affecting surface mounting parts in a structure in which a plurality of sheets of circuit substrate are superimposed each other. CONSTITUTION: When a plurality of sheets of circuit substrate are stacked...

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Bibliographic Details
Main Authors MURAYAMA TOSHIHIRO, IMAI YOSHIHIKO, TATSUNO YASUFUMI
Format Patent
LanguageEnglish
Korean
Published 24.10.2001
Edition7
Subjects
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Summary:PURPOSE: To provide an electronic circuit device which can readily be detached without adversely affecting surface mounting parts in a structure in which a plurality of sheets of circuit substrate are superimposed each other. CONSTITUTION: When a plurality of sheets of circuit substrate are stacked by forming a structure in which one side is joined with solders and the other side is joined with conductive adhesives by use of a metal piece as a spacer, it is possible to easily separate connection points and facilitate rework of parts interposed between circuit substrates. 본 발명의 전자 회로 장치는 복수의 회로 기판이 적층되는 구조를 갖고, 이 회로 기판이 적층될 시에, 스페이서로서 작용하는 금속편의 일단부가 숄더에 의해 회로 기판에 접합되는 반면에, 금속편의 다른 단부는 전도성 접착제에 의해 회로 기판에 접합되고, 이에 의해 회로 기판은 접속부에서 서로 용이하게 분리되고, 회로 기판 사이에 끼워진 상기 부품의 재가공이 용이하게 실행된다.
Bibliography:Application Number: KR20010013318