COPOLYMERS CONTAINING POLYAMIDE BLOCKS AND POLYETHER BLOCKS BASED ON ETHOXYLATED AMINES

• Main Authors: HILGERS HERMANN, LINEMANN REINHARD
• Format: Patent
• Language: English; Korean
• Published: 18.10.2001
• Edition: 7
• Subjects: ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; ADHESIVES; CHEMISTRY; COMPOSITIONS BASED THEREON; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS; DYES; MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS; METALLURGY; MISCELLANEOUS APPLICATIONS OF MATERIALS; MISCELLANEOUS COMPOSITIONS; NATURAL RESINS; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ORGANIC MACROMOLECULAR COMPOUNDS; PAINTS; POLISHES; THEIR PREPARATION OR CHEMICAL WORKING-UP; USE OF MATERIALS AS ADHESIVES

PURPOSE: Provided is a copolymer containing polyamide blocks and polyether blocks based on ethoxylated primary amines, which has a melting point of between 80 deg.C and 135 deg.C and an MFI(melt flow index) of between 5 and 80 g/10 min(2.16 kg-150 deg.C). CONSTITUTION: The copolymers contain polyamide blocks and polyether blocks based on ethoxylated primary amines. These copolymers have a melting point of between 80 deg.C and 135 deg.C and an MFI(melt flow index) of between 5 and 80 g/10 min (2.16 kg-150 deg.C). The polyamide blocks result from the condensation of one or more alpha,omega-aminocarboxylic acids and/or of one or more lactams containing from 6 to 12 carbon atoms in the presence of a dicarboxylic acid containing from 4 to 12 carbon atoms, and have a number average molecular weight(Mn) of 400 to 800. 본 발명은, 에톡시화 1차 아민을 기재로 하는 폴리아미드 블록 및 폴리에테르 블록을 함유하는 공중합체에 관한 것으로, 상기 공중합체는 융점이 80℃ ~ 135℃ 이며, MFI(용융 유속 지수)가 5 ~ 80 g/10 분(2.16 kg - 150℃)이다. 또한 본 발명은 폴리아미드 블록 및 폴리에테르 블록을 함유하는 상기 공중합체로 구성되는, 고온용융접착제(HMA) 형의 접착제에 관한 것이다.