METHOD FOR FORMING ALIGNMENT MARK OF WAFER

PURPOSE: A method for forming an alignment mark of a wafer is provided to prevent errors in measuring alignment by minimizing contrast difference between alignment marks when the degree of flatness of a wafer surface is poor. CONSTITUTION: At first the first alignment mark(22) is formed on the wafer...

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Bibliographic Details
Main Authors JUNG, JAE GWAN, OH, SEONG HYEON
Format Patent
LanguageEnglish
Korean
Published 11.07.2001
Edition7
Subjects
APPARATUS SPECIALLY ADAPTED THEREFOR
BASIC ELECTRIC ELEMENTS
CINEMATOGRAPHY
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
ELECTROGRAPHY
HOLOGRAPHY
MATERIALS THEREFOR
ORIGINALS THEREFOR
PHOTOGRAPHY
PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES
PHYSICS
SEMICONDUCTOR DEVICES
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Summary:PURPOSE: A method for forming an alignment mark of a wafer is provided to prevent errors in measuring alignment by minimizing contrast difference between alignment marks when the degree of flatness of a wafer surface is poor. CONSTITUTION: At first the first alignment mark(22) is formed on the wafer in a right square pattern(22a) and a rectangular stripe pattern(22b) which is far from a side of the right square pattern. Then, the first alignment mark is flattened. At last, the second alignment mark(23) is formed in the rectangular stripe pattern on a region far from the right square pattern and the first alignment mark in the stripe pattern to be far from the side of the first alignment mark with a constant distance.
Bibliography:Application Number: KR19990059621