PROCESS AND APPARATUS FOR PRODUCING A LAMINATE COMPRISING AT LEAST ONE POLYMER FILM WITH INFORMATION AND AT LEAST ONE SUBSTRATE FOR FURTHER PROCESSING FOR FORGERY-PROOF DOCUMENTS

• Main Authors: STIEMERT PETER, DORNER WOLFGANG, REIN JOHANN, HOEPPNER HARALD, KIENER WALDEMAR, SENGSTOCK NORBERT, LOER THOMAS, MUETEN DETLEF, RADTKE MICHAEL
• Format: Patent
• Language: English; Korean
• Published: 07.07.2001
• Edition: 7
• Subjects: BOOK COVERS; BOOKBINDING; DECORATIVE ARTS; DEVICES FOR USE THEREWITH AND NOT OTHERWISE PROVIDEDFOR; FILES; LAYERED PRODUCTS; LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM; LOOSE LEAVES; MOVABLE-STRIP WRITING OR READING APPARATUS; PERFORMING OPERATIONS; PRINTED MATTER CHARACTERISED BY IDENTIFICATION OR SECURITYFEATURES; PRINTED MATTER OF SPECIAL FORMAT OR STYLE NOTOTHERWISE PROVIDED FOR; SPECIAL DESIGNS OR PICTURES; SPECIAL PRINTED MATTER; TRANSPORTING

PURPOSE: A process and an apparatus for producing a laminate, comprising at least one polymer film with information and at least one substrate is provided to completely prevent the forgery of documents. CONSTITUTION: In the first processing station(31) of the process and apparatus for producing a laminate(44), a supporting film(23) is delaminated on a first side of the polymer film, after which a substrate(18) is laminated on by an adhesive and subsequently exposed to a crosslinking-active radiation. Then, the laminate led out from the first processing station is fed to a second processing station(51), and the supporting film is delaminated on a second side of the laminate, after which a substrate(19) is laminated on by an adhesive and subsequently exposed to a crosslinking-active radiation. 본 발명은 위조-방지 문서에 대해 추가 공정처리를 하기 위해, 정보를 갖는 최소한 하나의 폴리머 필름 및 최소한 하나의 판을 포함하는 라미네이트 제조 공정 및 장치에 관한 것으로서, 제 1 공정처리부(31)에서, 지지필름(23)이 폴리머 필름(17)의 제 1 사이드에 박리되고, 이어서 판(18)이 접착제에 의해 적층되고 순차적으로 교차결합-액티브 방사선에 노출되는 것이 특징이며, 제 1 공정처리부(31)로부터 나온 라미네이트(44)가 제 2 공정처리부(51)에 공급되고, 지지필름(23)이 라미네이트(44)의 제 2 사이드에 박리되며, 이어서 판(19)이 접착제에 의해 적층되고 순차적으로 교차결합-액티브 방사선에 노출되는 것이 특징이다.