SHIM FOR SEMICONDUCTOR WAFER POLISHING SYSTEM

PURPOSE: A shim for semiconductor wafer polishing system is provided to apply a uniform pressure to a wafer by improving a shim for controlling a location of a retainer ring. CONSTITUTION: A carrier(4) applies a polishing pressure to a wafer(1). A vertical rotary driving shaft is formed at a center...

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Bibliographic Details
Main Authors YOON, HYEON JU, LEE, SEONG BAE
Format Patent
LanguageEnglish
Korean
Published 07.07.2001
Edition7
Subjects
BASIC ELECTRIC ELEMENTS
DRESSING OR CONDITIONING OF ABRADING SURFACES
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
GRINDING
MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING
PERFORMING OPERATIONS
POLISHING
SEMICONDUCTOR DEVICES
TRANSPORTING
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Summary:PURPOSE: A shim for semiconductor wafer polishing system is provided to apply a uniform pressure to a wafer by improving a shim for controlling a location of a retainer ring. CONSTITUTION: A carrier(4) applies a polishing pressure to a wafer(1). A vertical rotary driving shaft is formed at a center of the carrier(4). A motor provides a rotary power to the vertical rotary driving shaft. A driving belt connects the rotary driving shaft with a shaft of the motor. A pressure plate(5) is formed at an inside of the carrier(4). A retainer ring(6) is installed around the pressure plate(5). The carrier(4), the pressure plate(5), and the retainer ring(6) are fixed by a combination screw(8). A shim(7) is inserted between the carrier(4) and the retainer ring(6).
Bibliography:Application Number: KR19990063170