LOW PROFILE INTEGRATED CIRCUIT PACKAGES

• Main Authors: TAI KING L, DUDDERAR THOMAS D, DEGANI YINON
• Format: Patent
• Language: English; Korean
• Published: 06.07.2001
• Edition: 7
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

PURPOSE: A method of fabricating IC package is provided to lower the height of an IC package. CONSTITUTION: The method includes the step of thinning the IC device of a chip form. At the final stage of assembly in which a chip is flip chip-bonded to a substrate, and the backside of the chip is expose...