COMPOSITION FOR INCREASING ACTIVITY OF A NO-CLEAN FLUX

• Main Authors: HENDERSON DONALD W, SPALIK JAMES
• Format: Patent
• Language: English; Korean
• Published: 04.07.2001
• Edition: 7
• Subjects: CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MACHINE TOOLS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; METAL-WORKING NOT OTHERWISE PROVIDED FOR; PERFORMING OPERATIONS; PRINTED CIRCUITS; SOLDERING OR UNSOLDERING; TRANSPORTING; WELDING; WORKING BY LASER BEAM

PURPOSE: A composition is provided which has an activator which enhances the solder wetting properties of a dicarboxylic acid and is completely volatile in a typical reflow profile so that non-wets when plated solders are used are reduced to acceptable levels while the low residue property of the flux is preserved. CONSTITUTION: The no-clean flux composition for use in soldering comprises a dicarboxylic acid; an organic solvent; and acetic acid in a concentration in the range of from about 2% to about 4% by weight, wherein the dicarboxylic acid is selected from the group consisting of adipic acid, pimelic acid, sebacic acid and combinations thereof, the dicarboxylic acid comprises about 1% to about 9% by weight of the composition, the carboxylic acid comprises about 4.5% by weight of the composition, and the acetic acid comprises about 2% by weight of the composition, wherein the pimelic acid comprises from about 1% to about 9% by weight of the composition, the pimelic acid comprises about 4.5% by weight of the composition, and the acetic acid comprises about 2% by weight of the composition, wherein the organic solvent comprises a first organic solvent selected from the group consisting of isopropanol, n-propanol and benzyl alcohol, and a second organic solvent selected from the group consisting of propylene glycol monobutyl ether, propylene glycol monopropyl ether, and diethylene glycol monomethyl ether, the first organic solvent comprises about 75% by weight of the organic solvent and the second organic solvent comprises about 25% by weight of the organic solvent, the first organic solvent is isopropanol, and the second organic solvent is propylene glycol monobutyl ether, and wherein the no-clean flux composition further comprises water in the amount of 0% to about 2% by weight.