HIGH-PRECISION PRESSURE SENSOR

• Main Authors: DONEDA SERGIO, OBERMEIER ERNST, ISENI GIOSUE, PREVE GIOVANBATTISTA
• Format: Patent
• Language: English; Korean
• Published: 25.06.2001
• Edition: 7
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MEASURING; MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER,MECHANICAL EFFICIENCY, OR FLUID PRESSURE; PHYSICS; SEMICONDUCTOR DEVICES; TESTING

PURPOSE: A pressure sensor is provided which invariably secures high measurement precision and reduces the change, deformation, and others of a measurement signal based on thermal expansion to the minimum level and has high reliability and durability, and relatively easily manufactures at a low cost. CONSTITUTION: A pressure sensor(1) is used for an extruding machine of a plastic material in particular, a chemical process, and others. The pressure sensor(1) is provided with a support element(3) for a semiconductor chip(5) having a strain gauge(9) on one of opposite faces, a casing(2) suitable to store the support element(3), a cover element(6) provided to close the casing(2), and a mechanical transfer element(8) stored in the cover element(6), faced to the semiconductor chip(5), and kept in contact with the semiconductor chip(5). The semiconductor chip(5) is stored to float in the support element(3). 본 발명의 압력 센서(1), 특히 플라스틱 재료 압출기용 압력 센서는 칩의 대향면 중 한쪽에 스트레인-게이지가 제공된 반도체 칩(5)용의 지지 부재(3)를 포함하는 외부 엔클로우저(2), 상기 엔클로우저를 폐쇄하도록 제공된 커버 부재(6), 상기 커버 부재(6) 내에 수용되며 반도체 칩(5)을 향하여 상기 칩과 접촉하는 기계식 전송 부재(8)를 포함하고, 상기 반도체 칩이 지지 부재 내에 부유하도록 수용되는 것을 특징으로 한다.