DEVELOPING APPARATUS AND METHOD THEREOF

• Main Authors: HAMADA MASAHITO, MATSUYAMA YUJI
• Format: Patent
• Language: English; Korean
• Published: 15.06.2001
• Edition: 7
• Subjects: APPARATUS SPECIALLY ADAPTED THEREFOR; BASIC ELECTRIC ELEMENTS; CINEMATOGRAPHY; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; ELECTROGRAPHY; HOLOGRAPHY; MATERIALS THEREFOR; ORIGINALS THEREFOR; PHOTOGRAPHY; PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES; PHYSICS; SEMICONDUCTOR DEVICES

PURPOSE: A development device is provided to prevent strain caused by temperature difference and improve the uniformity of the process. CONSTITUTION: A current plate(6) is arranged above a wafer holder(2) to hold a wafer W, and the roof(62) and the bottom plate(63) of this plate(6) are set so that each circulation port(62a,63a) may lie over the other in vertical direction, and a developer(D) is heaped upon the surface of the wafer. Then, the bottom plate(63) of the plate(6) is slid laterally so that the the circulation ports(62a,63a) may not lie upon the other in vertical direction, prior to development. By doing it this way, at development, the circulation ports(62a,63a) of the plate(6) are blocked in vertical direction, which intercept the air current to the wafer(W), so the occurrence of the temperature distribution of the developer(D) within the surface of the wafer, which is caused by the flow of the air to the wafer, is suppressed, and the occurrence of the unevenness in development caused by temperature difference is suppressed, and equal development treatment can be performed. 웨이퍼를 유지하는 웨이퍼 유지부의 상방 측에 정류부재를 배치하여, 이 정류부재의 천장판과 바닥판을, 각각의 통기공이 종방향으로 겹쳐지도록 위치시켜, 웨이퍼 표면에 현상액을 주입한다. 그 후의 정류부재의 바닥판을, 상기 통류공이 종방향으로 겹치지 않도록 횡방향으로 슬라이드 시켜 현상을 행한다. 이렇게 하면, 현상 시에는, 정류부재의 통류공이 종방향으로 좁아져 웨이퍼에의 기류가 차단되기 때문에, 웨이퍼에의 바람의 흐름이 원인이 된다. 웨이퍼의 면내에 있어서 현상액의 온도 분포의 발생이 억제되어져, 온도차에 의한 현상 얼룩의 발생이 억제되고, 균일한 현상처리를 행할 수 있다.