Conductive cap electronic component and method of forming insulating film of conductive cap

PURPOSE: Disclosed is a conductive cap which covers an electronic component mounted on a board, is capable of surely preventing a short circuit from occurring between itself and terminal electrodes on the board due to the fact that it comes into contact with them, and conducive to a reduction in siz...

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Bibliographic Details
Main Authors KAWABATA SHOICHI, KITAGAWA TAKESHI, INOUE JIRO, NISHIMURA TOSHIO, BABA TOSHIYUKI
Format Patent
LanguageEnglish
Korean
Published 15.03.2001
Edition7
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:PURPOSE: Disclosed is a conductive cap which covers an electronic component mounted on a board, is capable of surely preventing a short circuit from occurring between itself and terminal electrodes on the board due to the fact that it comes into contact with them, and conducive to a reduction in size and height of the electronic component. CONSTITUTION: A piezoelectric device(104) is mounted on the top surface(102a) of a board(102) where terminal electrodes(105,106) are formed, and an electronic part conductive cap(100) provided with an opening(103a) at its lower side is fixed on the top surface(102a) of the board so as to cover the piezoelectric device(104), where an insulating film(109) is provided to the edge face of the opening(103a) and its vicinity. 본 발명에 따른 전자 부품용 도전성 캡은 그 바닥부에 개구를 가지며, 적어도 단자 전극이 형성되어 있는 기판의 상면에 실장된 전자 부품 소자를 커버하기 위하여, 상기 캡의 개구 부분에서 상기 전자 부품의 기판의 상면에 고정되도록 구성된다. 상기 개구의 단면 및 상기 단면에 연결되는 내측 측면 및 외측 측면의 상기 단면 근방에는 절연막이 형성되어 있다.
Bibliography:Application Number: KR20000047451