Mounting method for electronic device elements and manufacturing method for surface acoustic wave device

• Main Authors: KITA RYOICHI, SHIMOE KAZUNOBU, TAGA SHIGETO
• Format: Patent
• Language: English; Korean
• Published: 15.03.2001
• Edition: 7
• Subjects: BASIC ELECTRIC ELEMENTS; BASIC ELECTRONIC CIRCUITRY; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIRCHEMICAL OR PHYSICAL PROPERTIES; MEASURING; PHYSICS; RESONATORS; SEMICONDUCTOR DEVICES; TESTING

PURPOSE: Disclosed is a method of mounting an electronic device element for forming an electronic component of small size and can bond an electronic device element to a packaging box having high reliability and has satisfactory electronic characteristics. CONSTITUTION: This method is for mounting an electronic device element in a packaging box(35) by applying ultrasonic waves to the element, while putting the pressing surface of a bonding tool(37) onto the bottom of the electronic device element having a metal bump(34) on its obverse surface. Here, the maximum length of the pressing surface of the bonding tool in the direction of vibration of the ultrasonic waves is larger than 0.5 times the maximum length of the bottom of the electronic device element in the direction of vibration of the ultrasonic waves. The pressing surface of the bonding tool has a hole(38) for vacuum-chucking the electronic device element, the hole(38) being positioned at the bottom of a portion where the metal bump of the element is not formed, when the electronic device element is vacuum-chucked. 본 발명은 전자 장치 소자를 탑재하는 방법에 관한 것으로서, 표면에 금속 범프를 갖는 전자 장치 소자를 준비하는 단계, 압력 표면을 갖는 본딩 기구를 준비하는 단계, 상기 본딩 기구의 압력면이 상기 전자 장치 소자의 배면에 접촉해 있도록 하는 단계, 및 상기 본딩 기구에 초음파를 인가하여 상기 전자 장치 소자를 탑재 기판에 탑재하는 단계를 포함한다. 초음파 진동 방향에 있어서 본딩 기구의 압력의 최대 길이는, 초음파 진동 방향에 있어서 전자 장치 소자의 배면의 최대길이의 0.5배를 초과한다.