SEMICONDUCTOR DEVICE AND MANUFACTURE OF THE SAME

PURPOSE: To provide a highly reliable semiconductor device by preventing peeling and missing of metal film formed at the external connecting terminals. CONSTITUTION: The recesses 42, 50 are formed following arrangement on the flat surface of connecting terminal formed to a metal base material 40 to...

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Bibliographic Details
Main Authors MOTOOKA SHUNSUKE, SAKOTA EIJI, YONEMOCHI MASAHIRO, SUWA MAMORU, MORIOKA MUNETOMO
Format Patent
LanguageEnglish
Korean
Published 26.01.2001
Edition7
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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