SEMICONDUCTOR DEVICE AND MANUFACTURE OF THE SAME

• Main Authors: MOTOOKA SHUNSUKE, SAKOTA EIJI, YONEMOCHI MASAHIRO, SUWA MAMORU, MORIOKA MUNETOMO
• Format: Patent
• Language: English; Korean
• Published: 26.01.2001
• Edition: 7
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

PURPOSE: To provide a highly reliable semiconductor device by preventing peeling and missing of metal film formed at the external connecting terminals. CONSTITUTION: The recesses 42, 50 are formed following arrangement on the flat surface of connecting terminal formed to a metal base material 40 to one surface thereof, after the internal surface and opening edge of the recesses 42, 50 are covered with a plating film 56 consisting of a metal that is not dissolved with the etchant to dissolve the metal base material 40, a plated film 56 is formed to the connecting terminal 58 as the flange area with the area of the plated film deposited to the opening edge of the recess isolated from the surface of the metal base material 40 by etching the surface of the metal base material 40, a semiconductor element is loaded on one surface of the metal base material 40 on which a connecting terminal 58 is formed, the electrode terminal of the semiconductor element and bottom surface of connecting terminal 58 are wire-bonded, one surface side of the metal base material 40 including the bonding wire and connecting terminal 58 is sealed with resin and the metal base material 40 is removed by dissolving with the etching to expose the connecting terminal 48 to the external surface.