BALL GRID ARRAY PACKAGE

• Main Author: MUN, JONG TAE
• Format: Patent
• Language: English; Korean
• Published: 15.01.2001
• Edition: 7
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

PURPOSE: A ball grid array package is provided to enhance a junction intensity of a solder ball by forming a metal core in a ball land, and tightly connect the solder ball to the metal core together with a chemical reaction with the metal core. CONSTITUTION: A ball grid array package includes a semiconductor chip, a signal transmission media, a covering part(10), a metal core, and a solder ball(40). The signal transmission media is attached on the semiconductor chip, is electrically connected to a bonding pad of the semiconductor chip, and has a ball land. The covering part molds the resultant material in order to expose only the ball land of the signal transmission media. The metal core is formed on the ball land. The solder ball is mounted to the ball land, is fixedly supported by the metal core. A chemical reaction between the ball and the metal core occurs. The metal core is made of a gold or silver, and its shape is a cylinder shape or a core shape. If the metal core is a cylinder shape, an upper part of the metal core is made as a dish shape. Thereby, the ball grid array package enhances a junction intensity of a solder ball by forming a metal core in a ball land, and tightly connecting the solder ball to the metal core together by a chemical reaction with the metal core.